Properties

Ceramic substrates are manufactured from advanced ceramic materials such as Al2O3, AlN & Si3N4, offering excellent electrical insulation, high-temperature resistance, and thermal conductivity. They possess superior solderability and high adhesion strength, allowing the etching of complex circuit patterns similar to PCBs and supporting high current-carrying capacity. As a result, ceramic substrates have become foundational materials in high-power electronics circuit structures and interconnect technologies.

Advantages

• Excellent Thermal Cycling Capability Maintains stable performance through repeated temperature changes, extending device lifespan.
• Thermal Shock Resistance Withstands rapid temperature fluctuations, preventing material cracking.
• High Flexural Strength Offers robust bending resistance, suitable for harsh mechanical stress environments.
• Surface Quality Smooth, defect-free surface enhances stable circuit connections and component mounting.
• High Thermal Conductivity Efficient heat dissipation, ideal for high-power and high-density electronic applications.